Printed wiring board and method for manufacturing the same

摘要

A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate.

主权项

1. A printed circuit board, comprising:
a core substrate; a first conductive pattern formed on a first surface of the core substrate; a second conductive pattern formed on a second surface of the core substrate on an opposite side of the core substrate with respect to the first surface; and a through hole conductor formed through the core substrate and comprising a plated material such that the through hole conductor is connecting the first conductive pattern and the second conductive pattern, wherein the plated material of the through hole conductor is formed in a through hole formed in the core substrate such that the plated material is filling the through hole of the core substrate, the core substrate includes an insulation layer including an inorganic fiber material and a resin material, a first resin layer formed on one surface of the insulation layer and having the first surface of the core substrate, and a second resin layer formed on an opposite surface of the insulation layer and having the second surface of the core substrate, the first and second resin layers are formed such that the first and second resin layers do not contain an inorganic fiber material and a sum of thicknesses of the first and second resin layers is set in a range of 20% or less of a thickness of the core substrate, the first resin layer of the core substrate includes an inorganic filler material, the second resin layer of the core substrate includes an inorganic filler material, and the first resin layer of the core substrate includes the inorganic filler material such that an amount of the inorganic filler material in the first resin layer decreases from the insulation layer toward the first surface of the core substrate.