发明名称 SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device with high sensitivity.SOLUTION: A solid-state imaging device includes: a semiconductor substrate; a photodiode provided on a surface of the semiconductor substrate; a first insulating film formed on the surface of the semiconductor substrate and having a first refractive index; a second insulating film provided above the photodiode via the first insulating film and having a second refractive index higher than the first refractive index; a third insulating film provided on the second insulating film above the photodiode and having a third refractive index higher than the second refractive index; and a microlens provided above the photodiode.
申请公布号 JP2015126101(A) 申请公布日期 2015.07.06
申请号 JP20130269433 申请日期 2013.12.26
申请人 TOSHIBA CORP 发明人 NAGAMURA HIDEKI;IWASA SEIICHI
分类号 H01L27/14;H01L31/10 主分类号 H01L27/14
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