| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress chipping and to improve transverse intensity.SOLUTION: A method for manufacturing an acoustic wave device includes the steps of: forming altered regions 18 in a support substrate 10 configured by joining a piezoelectric substrate 12 to its upper surface by irradiating the support substrate 10 with laser beams; forming grooves 20 on an upper surface of the piezoelectric substrate so as to be overlapped to the altered regions; and cutting off the support substrate on the grooves. The acoustic wave device includes the support substrate in which the altered regions are formed by irradiating a side face with laser beams and the piezoelectric substrate joined to the support substrate and configured so that at least an upper part out of side faces is formed more inside than the side face of the support substrate.</p> |
