| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor device allowing easy change of a relation of connection according to changes in specification and the like of a control IC, and maintaining high reliability in a case where, when a sensor is packaged, the control IC is packaged together with the sensor without using resin seal, and to provide a manufacturing method of the sensor device.SOLUTION: The sensor device of the invention comprises: a substrate which contains an organic material, in which a recess or an opening is formed, and has wiring; a metal substrate arranged in the recess or opening of the substrate; a sensor arranged on the metal substrate and electrically connected to the wiring; and a package cap arranged on the substrate and including an organic material covering the sensor. The package cap has a salient on a side opposite to a side facing the sensor arranged on the substrate, and a hollow inside. A thermal expansion coefficient value of the substrate is substantially equal to a thermal expansion coefficient value of the package cap. |
