WAFER DEFECT INSPECTION APPARATUS AND METHOD FOR INSPECTING A WAFER DEFECT

摘要

It is judged whether or not an average gray level of an image of a wafer W that is an inspection target and that has been imaged by the light receiving part 2 is in the defect detectable range. A control processing part 6a is configured to modify an exposure time in imaging the wafer W and to obtain an image of the wafer W again by the light receiving part 2 in the case in which it is decided that an average gray level of an image of the wafer W is not in a defect detectable range, and an image processing part 6b is configured to carry out a defect inspection based on an image of the wafer W in the case in which it is decided that an average gray level of the image of the wafer W is in the defect detectable range.

主权项

1. A wafer defect inspection apparatus comprising:
a wafer mounting means configured to mount a wafer that is an inspection target; an irradiation means configured to irradiate the wafer with an infrared light; an imaging means configured to image the wafer that has been irradiated with an infrared light; an inspection means configured to inspect a defect of the wafer based on an image of the wafer that has been imaged by the imaging means; a gray level judgment means configured to judge whether or not a reference gray level of an image of the wafer that is an inspection target and that has been imaged by the imaging means is in the predetermined gray level range; and a control means configured to modify an exposure time in imaging the wafer and to obtain an image of the wafer again by the imaging means in the case in which it is decided that a reference gray level of an image of the wafer is not in the predetermined gray level range,wherein the inspection means is configured to carry out a defect inspection based on an image of the wafer in the case in which it is decided that a reference gray level of the image of the wafer is in the predetermined gray level range.