发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME |
摘要 |
This semiconductor device (100) includes: a gate electrode (12) formed on a substrate (10); a gate insulating layer (20) formed over the gate electrode; an oxide semiconductor layer (18) formed on the gate insulating layer; source and drain electrodes (14, 16) connected to the oxide semiconductor layer; and an insulating layer (22) formed over the source and drain electrodes. The insulating layer includes a silicon nitride layer (22a) which contacts with at least a part of the upper surface of the source and drain electrodes and of which the thickness is greater than 0 nm and equal to or smaller than 30 nm, and a silicon oxide layer (22b) which has been formed on the silicon nitride layer and which has a thickness of more than 30 nm. |
申请公布号 |
US2015187948(A1) |
申请公布日期 |
2015.07.02 |
申请号 |
US201314417232 |
申请日期 |
2013.07.19 |
申请人 |
Sharp Kabushiki Kaisha |
发明人 |
Misaki Katsunori |
分类号 |
H01L29/786;H01L29/66;H01L21/441;H01L21/02;H01L21/477;H01L29/45;H01L29/24 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a substrate; a gate electrode formed on the substrate; a gate insulating layer formed over the gate electrode; an oxide semiconductor layer formed on the gate insulating layer; source and drain electrodes electrically connected to the oxide semiconductor layer; and an insulating layer formed over the source and drain electrodes, wherein the insulating layer includes a silicon nitride layer which contacts with at least a part of the upper surface of the source and drain electrodes and of which the thickness is greater than 0 nm and equal to or smaller than 30 nm, and a silicon oxide layer which is formed on the silicon nitride layer and of which the thickness is greater than 30 nm. |
地址 |
Osaka-shi, Osaka JP |