FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.

主权项

1. A method for manufacturing a flexible printed circuit board used for near field communication comprising:
forming a printed circuit substrate having a first conductive circuit layer, comprising at least one first conductive circuit arranged as spiral-shaped and defining a plurality of first spaces, and an insulating layer adhered to the first conductive circuit layer; filling the plurality of first spaces with resin, to form a first resin layer adhered to a surface of the insulating layer; and forming a first cover layer on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.