| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide brazing material capable of reducing unnecessary protrusions at joint portions and lowering degradation of joint strength due to oxidation of active metal; to provide a circuit board capable of reducing the possibility of short-circuit even when the space between neighboring circuit members is narrowed, dealing with high integration, and achieving high joint strength of a circuit member, a heat dissipation member, and a supporting substrate, by using the brazing material; and to provide an electronic device mounted with electronic components on the circuit member in the circuit board. <P>SOLUTION: The brazing material includes silver and copper as main components; at least a kind of element A selected from indium, zinc, and tin; a hydrogen compound of at least a kind of element B selected from titanium, zirconium, hafnium, and niobium; and at least a kind of element C selected from molybdenum, osmium, rhenium, and tungsten. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
