| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To dissipate heat generated from each of semiconductor chips stacked via bumps efficiently. <P>SOLUTION: The thermal interposer 6 connected electrically and thermally, via bumps 7, between a plurality of semiconductor chips 5 and to at least one position on the underside of the semiconductor chip 5 in the lowermost layer and diffusing heat comprises an interposer substrate 11AB having an internal space 15, an upper through conductor 16A penetrating from the internal space to the upper outside, and a lower through conductor 16B penetrating from the internal space to the lower outside, bump bonding parts 12X provided in the internal space and bonding the upper through conductor and the lower through conductor, a porous body 13 provided in the internal space in contact with the bump bonding parts, and refrigerant 14 enclosed in the internal space. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
