LED PACKAGE

摘要

Disclosed is a light emitting diode package. The light emitting diode package comprises an upper side including a first plane and a second plane stepped from the first plane. The upper side comprises: a light emitting device including a conductive substrate having a length in a first direction, and a width in a second direction perpendicular to the first direction, a first insulating layer formed on the first plane, a first electrode layer separated from the second plane and arranged on the first insulating layer, and a light emitting diode arranged on the second plane and having a first electrode and a second electrode connected with the first electrode layer and the conductive substrate respectively; a heat sink including a first side facing the first electrode layer, a second side facing a lower side of the conductive substrate opposite to the upper side and in parallel with the first side, and an insertion groove which connects the first side and the second side, is formed by a bottom side having a length in the first direction and a width in a third direction perpendicular to the first direction and at least part of the light emitting diode is inserted into; a second electrode layer arranged on the bottom side, and electrically connected with the conductive substrate as being in contact with a lateral side of the conductive substrate, which connects the upper side to the lower side of the conductive substrate; and a third electrode layer arranged on the first side, and in contact with the first electrode layer.