发明名称 THREE-DIMENSIONAL WIRE BOND INDUCTOR
摘要 An inductor is provided on a substrate that includes a capacitor. The inductor comprises a series of wire loops. An end of the wire loop is wire bonded to the capacitor.
申请公布号 US2015180437(A1) 申请公布日期 2015.06.25
申请号 US201414177620 申请日期 2014.02.11
申请人 QUALCOMM Incorporated 发明人 Zuo Chengjie;Velez Mario Francisco;Kim Jonghae;Kim Daeik Daniel;Yun Changhan Hobie
分类号 H03H7/01 主分类号 H03H7/01
代理机构 代理人
主权项 1. A circuit, comprising: a substrate including a surface; a capacitor integrated with the substrate, the capacitor including a metal plate adjacent the surface; and a series of wire loops configured to project from the surface, wherein the wire loops are coupled together to form an inductor extending from a first end of a first one of the wire loops to an end of a last one of the wire loops, wherein the first end of the first wire loop is bonded to the metal plate of the capacitor.
地址 San Diego CA US