INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF

摘要

An integrated circuit packaging system and method of manufacture thereof including: an integrated circuit die having a contact pad; a redistribution layer on the contact pad, the redistribution layer having a chip contact, a trace, and a bump pad, the redistribution layer having a curved top surface and sidewalls which are planar; an upper passivation layer on the sidewalls of the redistribution layer with the area above the bump pad of the redistribution layer exposed from the upper passivation layer; and an external interconnect attached over the bump pad.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing an integrated circuit die having a contact pad; depositing a lower passivation layer on the integrated circuit die leaving the contact pad exposed; patterning a pattern mask having mask openings on the lower passivation layer; forming a redistribution layer on the contact pad and the lower passivation layer by depositing a conductive ink in the mask openings; removing the pattern mask; depositing an upper passivation layer over the redistribution layer leaving a portion of the redistribution layer exposed; and attaching an external interconnect to the redistribution layer.