| 发明名称 |
METAL COPPER CLAD LAMINATE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A metal copper clad laminate (MCCL) includes a metal base, an insulating layer and a copper foil. The metal base has at least one recess defined in one surface thereof. The insulating layer is laminated on the one surface of the metal base and has a first opening exposing the at least one recess. The copper foil is laminated on the insulating layer and has a second opening exposing the at least one recess and the first opening. |
| 申请公布号 |
US2015176819(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414472092 |
申请日期 |
2014.08.28 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM Young Kyung;KWON Jae Wook;LIM Seog Ho;HONG Seok Chan |
| 分类号 |
F21V19/00;H05K3/00;F21V29/89;H05K1/05;F21V21/00;H05K3/10;H05K3/38 |
主分类号 |
F21V19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A metal copper clad laminate (MCCL), comprising:
a metal base having at least one recess defined in one surface thereof; an insulating layer laminated on the one surface of the metal base and having a first opening exposing the at least one recess; and a copper foil laminated on the insulating layer and having a second opening exposing the at least one recess and the first opening. |
| 地址 |
Suwon-si KR |
