STUB MINIMIZATION WITH TERMINAL GRIDS OFFSET FROM CENTER OF PACKAGE

摘要

A microelectronic package includes a microelectronic element having memory storage array function overlying a first surface of a substrate, the microelectronic element having a plurality of contacts aligned with an aperture in the substrate. First terminals which are configured to carry all address signals transferred to the package can be exposed within a first region of a second substrate surface, the first region disposed between the aperture and a peripheral edge of the substrate. The first terminals may be configured to carry all command signals, bank address signals and command signals transferred to the package, the command signals being write enable, row address strobe, and column address strobe.

主权项

1. A microelectronic package, comprising:
a substrate having a first surface and a second surface opposite one another with an aperture extending from the first surface to the second surface, the aperture having an axis extending in a direction of a longest dimension of the aperture, the second surface having a region disposed between the axis and an edge of the substrate; a microelectronic element having a front surface facing the first surface of the substrate and a plurality of contacts associated with the front surface of the microelectronic element aligned with the aperture; a plurality of terminals associated with the second surface of the substrate for connecting the microelectronic package to at least one component external to the microelectronic package; leads passing through the aperture coupling the plurality of contacts of the microelectronic element and the plurality of terminals of the substrate; and wherein a portion of the plurality of terminals are in the region of the second surface of the substrate for carrying all of the address signals for the microelectronic element provided to the microelectronic package.