SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a substrate having a first surface and a second surface. A semiconductor chip is disposed on the first surface of the substrate. A first metal pattern is disposed on a central portion of the second surface. A second metal pattern is disposed on the second surface and spaced from the first metal pattern. A thermal conducting material is affixed to the first and second metal patterns. The first metal pattern has no two outer edges that meet to form an angle that is 90° or less, and the second metal pattern is between the first metal pattern and an outer edge of the substrate.

主权项

1. A semiconductor device, comprising:
a substrate having a first surface and a second surface opposite the first surface; a semiconductor chip disposed on the first surface; a first metal pattern disposed on a central portion of the second surface; a second metal pattern disposed on the second surface and spaced from the first metal pattern; and a thermal conducting material affixed to the first and second metal patterns, wherein the first metal pattern has no two outer edges that meet to form an angle that is 90° or less, and the second metal pattern is between the first metal pattern and an outer edge of the substrate.