发明名称 |
剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
摘要 |
A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate. |
申请公布号 |
JP5740583(B2) |
申请公布日期 |
2015.06.24 |
申请号 |
JP20120060125 |
申请日期 |
2012.03.16 |
申请人 |
東京エレクトロン株式会社;インテル コーポレーションINTEL CORPORATION |
发明人 |
平河 修;本田 勝;ザビエル フランソワ ブリュン;チャールズ ウェイン シングルトン ジュニア |
分类号 |
H01L21/02;H01L21/677;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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