| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection structure having low connection resistance between electrodes and high thermal shock resistance characteristics. <P>SOLUTION: A connection structure 1 includes: a first connecting object member 2 having a first electrode 2b on an upper surface 2a thereof; a second connecting object member 4 having a second electrode 4b on a lower surface 4a thereof; and a connection 3 which is disposed between the upper surface 2a of the first connecting object member 2 and the lower surface 4a of the second connecting object member 4 and formed by an anisotropic conductive material containing conductive particles 21, and in which the first electrode 2b and the second electrode 4b are electrically connected by the conductive particles 21. The conductive particle 21 includes a resin particle 22, a first conductive layer 23, and a second conductive layer 24 of which the melting point is lower than that of the first conductive layer 23. The first conductive layer 23 in the conductive particles 21 electrically connecting first and second electrodes 2b and 4b is in contact with the first electrode 2b and the second electrode 4b. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
