发明名称 |
Gas sensor having micro-package structure and method for making the same |
摘要 |
A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact. |
申请公布号 |
US9063084(B1) |
申请公布日期 |
2015.06.23 |
申请号 |
US201414171378 |
申请日期 |
2014.02.03 |
申请人 |
LINGSEN PRECISION INDUSTRIES, LTD. |
发明人 |
Lin Tzu-Chih;Liao Chien-Ko |
分类号 |
G01N21/61;G01N33/00;H01L23/00;C09J5/00 |
主分类号 |
G01N21/61 |
代理机构 |
Muncy, Geissler, Olds & Lowe, P.C. |
代理人 |
Muncy, Geissler, Olds & Lowe, P.C. |
主权项 |
1. A gas sensor having a micro-package structure, the gas sensor comprising:
a substrate, having a light-emitting area, a light-receiving area, and a signal-processing area; a light-emitting unit, being deposited in the light-emitting area and providing an optical signal; a light-receiving unit, being deposited in the light-receiving area and receiving the optical signal of the light-emitting unit; a signal-processing unit, being deposited in the signal-processing area and electrically connected to the light-receiving unit; and a package body, being fixed to the substrate and having a chamber and a through hole, wherein the chamber accommodates the light-emitting unit, the light-receiving unit, and the signal-processing unit, and the through hole is over the substrate. |
地址 |
Taichung TW |