发明名称 Gas sensor having micro-package structure and method for making the same
摘要 A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.
申请公布号 US9063084(B1) 申请公布日期 2015.06.23
申请号 US201414171378 申请日期 2014.02.03
申请人 LINGSEN PRECISION INDUSTRIES, LTD. 发明人 Lin Tzu-Chih;Liao Chien-Ko
分类号 G01N21/61;G01N33/00;H01L23/00;C09J5/00 主分类号 G01N21/61
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A gas sensor having a micro-package structure, the gas sensor comprising: a substrate, having a light-emitting area, a light-receiving area, and a signal-processing area; a light-emitting unit, being deposited in the light-emitting area and providing an optical signal; a light-receiving unit, being deposited in the light-receiving area and receiving the optical signal of the light-emitting unit; a signal-processing unit, being deposited in the signal-processing area and electrically connected to the light-receiving unit; and a package body, being fixed to the substrate and having a chamber and a through hole, wherein the chamber accommodates the light-emitting unit, the light-receiving unit, and the signal-processing unit, and the through hole is over the substrate.
地址 Taichung TW