| 发明名称 | Etching composition and method of manufacturing a display substrate using the system | ||
| 摘要 | An etching composition and a method of manufacturing a display substrate using the etching composition are disclosed. The etching composition includes phosphoric acid (H3PO4) of about 40% by weight to about 70% by weight, nitric acid (HNO3) of about 5% by weight to about 15% by weight, acetic acid (CH3COOH) of about 5% by weight to about 20% by weight, and a remainder of water. Thus, a metal layer including copper may be stably etched. | ||
| 申请公布号 | US9062244(B2) | 申请公布日期 | 2015.06.23 |
| 申请号 | US201213534502 | 申请日期 | 2012.06.27 |
| 申请人 | SAMSUNG DISPLAY CO., LTD.;DONGWOO FINE-CHEM CO., LTD. | 发明人 | Park Hong-Sick;Lee Wang-Woo;Kim Bong-Kyun;Kwon O-Byoung;Shim Kyung-Bo;Jang Sang-Hoon |
| 分类号 | H01L21/302;H01L21/461;C09K13/04;C23F1/18;C23F1/02;C23F1/38;C23F1/44;C09K13/08;H01L21/3213;H01L27/12 | 主分类号 | H01L21/302 |
| 代理机构 | Innovation Counsel LLP | 代理人 | Innovation Counsel LLP |
| 主权项 | 1. An etching composition comprising: phosphoric acid (H3PO4) of about 40% by weight to about 45% by weight; nitric acid (HNO3) of about 10% by weight to about 13% by weight; acetic acid (CH3COOH) of about 12% by weight to about 15% by weight; and an amount of water between about 27% by weight and about 48% by weight. | ||
| 地址 | KR | ||