PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of highly accurately controlling a process in the plasma processing apparatus which performs temporal modulation of plasma-generating high frequency power and high frequency bias power.SOLUTION: A plasma processing apparatus includes: a plasma processing chamber in which plasma processing is applied to a sample; a first high frequency power supply for supplying first high frequency power for generating plasma; a sample stand for placing a sample; a second high frequency power supply for supplying second high frequency power to the sample stand; and a pulse generation unit for transmitting a first pulse for performing temporal modulation of the first high frequency power to the first high frequency power supply and transmitting a second pulse for performing temporal modulation of the second high frequency power to the second high frequency power supply. The pulse generation unit includes a phase control waveform generation part for generating a phase modulating waveform for modulating a phase in an ON period of the second pulse to modulate the phase of the ON period of the second pulse by the phase modulating waveform.