HIGH YIELD SUBSTRATE ASSEMBLY

摘要

High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

主权项

1. An article of manufacture comprising:
a substrate assembly configured for formation of integrated circuit device structures thereon, said substrate assembly comprising: a plurality of substrates bonded to one another on edges of said plurality of substrates, and wherein said substrate assembly is configured for use with integrated circuit manufacturing equipment designed to process wafers larger than individual instances of said plurality of substrates.