发明名称 ELECTRONIC APPARATUS AND CIRCUIT MODULE
摘要 According to one embodiment, an electronic apparatus includes a circuit module. The circuit module includes a flexible substrate. The flexible substrate includes a base portion having a mounting surface, and an extension portion. On the mounting surface, conductor patterns are provided. A switch is provided in a fore-end portion of the extension portion and includes an operating portion operated by a pushing portion of a housing. A first pressure receiving portion is located behind the switch. A second pressure receiving portion is provided on the mounting surface. The extension portion is folded back once toward the mounting surface.
申请公布号 US2015170851(A1) 申请公布日期 2015.06.18
申请号 US201414459109 申请日期 2014.08.13
申请人 Kabushiki Kaisha Toshiba 发明人 Muro Kiyomi;Ogawa Hideki
分类号 H01H13/04;H01H13/14 主分类号 H01H13/04
代理机构 代理人
主权项 1. An electronic apparatus comprising: a housing provided with a pushing portion; and a circuit module provided inside the housing, wherein the circuit module comprises: a flexible substrate comprising a base portion comprising a mounting surface, and an extension portion extending from a periphery of the base portion, the mounting surface being provided with a plurality of conductor patterns thereon;a switch provided in a fore-end portion of the extension portion of the flexible substrate and comprising an operating portion operated by the pushing portion;a first pressure receiving portion provided in the fore-end portion of the extension portion of the flexible substrate and located behind the switch; anda second, pressure receiving portion provided on the mounting surface of the flexible substrate,wherein, by folding back the extension portion toward the mounting surface once, the switch is interposed between the first and second pressure receiving portions, the operating portion of the switch faces the second pressure receiving portion, and the first pressure receiving portion faces to the direction of the pushing portion.
地址 Tokyo JP