METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

Provided are a method for fabricating a semiconductor package to make a thin semiconductor package and the semiconductor package using the same. Also, provided are a method for fabricating a semiconductor package capable of removing a printed circuit board (PCB), and the semiconductor package using the same. For this, the method for fabricating a semiconductor package according to an embodiment of the present invention includes: (A) a step of arranging a first semiconductor die on a carrier to allow a first surface exposing a bond pad to face an upper side; (B) a step of arranging a second semiconductor die on the first semiconductor die by mismatching to allow a first surface exposing the bond pad to face an lower side; (C) a step of encapsulating the first semiconductor die and the second semiconductor die with an encapsulant; and (D) a step of forming a through-hole in the encapsulant to expose the bond pad of the first semiconductor die and the bond pad of the second semiconductor die.