| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the warpage or the crack of a chip component by including an elastic spacer in an anisotropic conductive layer. <P>SOLUTION: A conductive grain containing layer 2 and an insulating resin layer 3 are laminated to make a multilayer structure so as to have the elastic spacer 4 in the boundary between the conductive grain containing layer 2 and the insulating resin layer 3. The hardness (20% K value) of the elastic spacer 4 is 20-500 kgf/mm<SP>2</SP>and the particle diameter D of the same is 10-50μm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
