Curable resin compositions

摘要

A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

主权项

1. A solventless curable epoxy resin composition comprising (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the curable epoxy resin composition is at least a three-component composition, such that the three-component composition includes (i) (a1) at least a first epoxy resin being at least one divinylarene dioxide; and (a2) at least a second epoxy resin different from the first epoxy resin and at least one hardener component (b); or (ii) at least one divinylarene dioxide component (a) and (b1) at least a first hardener, and (b2) at least a second hardener different from the first hardener; wherein the solventless curable epoxy resin composition is solvent-free; wherein the solventless curable epoxy resin composition has at least two exotherm peaks; and wherein the exothermic peak difference of the two exotherm peaks, when measured by differential scanning calorimetry with a heating rate of 10° C./minute, is greater than or equal to 20° C. and sufficient to allow the solventless curable epoxy resin composition to be B-staged.