电镀装置;ELECTROPLATING APPARATUS

摘要

本发明系有关于一种电镀装置，系包括：基板支持具，系用以支持基板；阳极支持具，系用以支持阳极；基板放置/拆卸部，系用以对前述基板支持具放置/拆卸基板；暂时储存处，系用以将前述阳极支持具移出至电镀装置外部；电镀槽，系设置于前述基板放置/拆卸部与前述暂时放置处之间，且将支持有基板之基板支持具及支持有阳极之阳极支持具对向而配置，以进行电镀处理；及运输器，可在前述基板放置/拆卸部与前述暂时放置处之间搬运基板支持具及阳极支持具。; an anode holder for holding anode; a mounting/dismounting unit for mounting the substrate on the substrate holder and dismounting the substrate from the substrate holder; a temporary storing unit for removing the anode holder outside the electroplating apparatus; a plating tank disposed between the mounting/dismounting unit and the temporary storing unit, set the substrate holder holding a substrate and the anode holder holding an anode being face to each other for performing plating process; and a transporter for transporting the substrate between the mounting/dismounting unit and the temporary storing unit.