Provided is an apparatus for manufacturing a semiconductor, capable of reducing time and costs for maintenance and repair and improving an operating rate. The apparatus for manufacturing the semiconductor according to the present invention includes a chamber which receives a substrate for processing, a first electrode which provides a processing environment in the chamber, a second electrode which corresponds to the first electrode, and a first power transmission rod which is connected to at least one of the first electrode and the second electrode. The first power transmission rod has a first conductive stress attenuating part between a first one end and a first other end which is opposite to the first one end.
申请公布号
KR20150064993(A)
申请公布日期
2015.06.12
申请号
KR20130149997
申请日期
2013.12.04
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, JU HEE;PARK, JAE BEOM;LEE, SU HO;JANG, WON HYUK;KIM, MYOUNG WOON;KIM, IK SOO