METHOD OF PROCESSING A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME

摘要

A method for processing a substrate according to the present invention comprises the steps of: generating first plasma from first reaction gas; generating second plasma from second reaction gas; and separately supplying the first plasma and the second plasma to a substrate. Therefore, the substrate is processed using two or more kinds of plasma generated under different process conditions optimized for allowing each of two or more remote plasma sources to process a substrate, thereby having a desired shape.