SLIM LED PACKAGE

摘要

Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.

主权项

1. A light emitting diode (LED) package, comprising:
a first lead frame and a second lead frame separated from each other; an LED chip disposed on the first lead frame and electrically connected with second lead frame; and a resin covering at least portions of surfaces of the first and second lead frames, wherein at least one of the first and second lead frames comprises one or more bond force-increasing components disposed on at least a portion of at least one side of the lead frame.