Power Conversion Apparatus

摘要

A power conversion apparatus includes power semiconductor modules (300U, 300V, 300W), a first flow path forming body (110) that forms a first flow path, a second flow path forming body (401) that forms a second flow bath, a first base plate (400) for mounting the second flow path forming body thereon, a drive circuit board (200), and a case (101). The drive circuit board (200) is provided so that a mounting surface of the drive circuit faces a side wall of the second flow bath forming body (401). The second flow path forming body (401) forms a housing space for housing the power semiconductor modules (300U, 300V, 300W). Further, the second flow path forming body (401) forms an insertion opening that leads to the housing space, on a side wall facing the mounting surface of the drive circuit. The power semiconductor modules (300U, 300V, 300W) have a control terminal that is connected to the &rive circuit board (200) by passing through the insertion opening. Then, the first flow path forming body (110) is fixed to the case (101). Because of this structure, it is possible to achieve further improvement in the ease of assembly of the power conversion apparatus.

主权项

1. A power conversion apparatus comprising:
a power semiconductor module including a power semiconductor element designed to convert a direct current to an alternating current; a first flow path forming body that forms a first flow path for allowing cooling refrigerant to flow therethrough; a second flow path forming body that forms a second flow path for allowing cooling refrigerant to flow therethrough; a first base plate for mounting the second flow path forming body thereon; a drive circuit board mounted with a drive circuit to output a drive signal to drive the power semiconductor element; and a case for housing the power semiconductor module, the first flow path forming body, the second flow path forming body, the first base plate, and the drive circuit board, wherein the drive circuit board is provided so that the mounting surface of the drive circuit faces a side wall of the second flow path forming body, wherein the second flow path forming body forms a housing space for housing the power semiconductor module, wherein the second flow path forming body further forms an insertion opening that leads to the housing space on the side wall facing the mounting surface of the drive circuit, wherein the power semiconductor module has a control terminal that is connected to the drive circuit board by passing through the insertion opening, wherein the first flow path forming body is fixed to the case, wherein the first flow path forming body further forms an opening portion leading to the first flow path, wherein the first base plate is designed to close the opening portion and to be connected to the first flow path forming body, and wherein the first base plate further forms a first through hole connecting the first flow path and the second flow path.