| 主权项 |
1. A circuit board, comprising:
an insulation layer, having an upper surface and a lower surface opposite to each other; a patterned circuit layer, embedded in the insulation layer, and a surface of the patterned circuit layer aligned with the upper surface of the insulation layer, wherein the insulation layer has at least one blind via extending from the lower surface to the patterned circuit layer; a conductive connecting structure, comprising a conductive pattern layer and at least one conductive pillar, wherein the conductive pattern layer is disposed on the lower surface of the insulation layer, and the conductive pillar is disposed inside the blind via and connects the patterned circuit layer and the conductive pattern layer; a first solder resist layer, disposed on the lower surface of the insulation layer, and having at least one first opening, wherein the first opening exposes a portion of the conductive pattern layer so as to define at least one first pad; a second solder resist layer, disposed on the upper surface of the insulation layer, and having at least one second opening, wherein the second opening exposes a portion of the patterned circuit layer so as to define at least one second pad; and at least one conductive bump, disposed on the second pad, wherein a top surface of the conductive bump is higher than a second surface of the second solder resist layer. |
