| 发明名称 |
Electronic device and method of packaging an electronic device |
| 摘要 |
An electronic device can include a package device structure including a die encapsulated within a packaging material. The package device structure can have a first side and a second side opposite the first side. The electronic device can include a first layer along the first side of the package device structure. The first layer can be capable of causing a first deformation of the package device structure. The electronic device can also include a second layer along the second side of the package device structure. The second layer can be capable of causing a second deformation of the package device structure, the second deformation opposite the first deformation. |
| 申请公布号 |
US9054111(B2) |
申请公布日期 |
2015.06.09 |
| 申请号 |
US200912419708 |
申请日期 |
2009.04.07 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Xu Jianwen;Keser Lizabeth Ann A.;Leal Goerge R.;Yeung Betty H. |
| 分类号 |
H01L23/495;H01L23/538;H01L23/31;H01L23/498;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a package device structure including a singulated die encapsulated on at least three sides within a packaging material, the package device structure having a first side and a second side opposite the first side; a first layer along the first side of the package device structure and distinct from the singulated die, the first layer causing a first deformation of the package device structure; and a second layer along the second side of the package device structure and distinct from the singulated die, the second layer causing a second deformation of the package device structure, wherein the second deformation is opposite the first deformation, a thickness of the second layer based upon the first deformation. |
| 地址 |
Austin TX US |
