Contact resistance test structure and method suitable for three-dimensional integrated circuits

摘要

A contact resistance test structure, a method for fabricating the contact resistance test structure and a method for measuring a contact resistance while using the contact resistance test structure are all predicated upon two parallel conductor lines (or multiples thereof) that are contacted by one perpendicular conductor line absent a via interposed there between. The test structure and related methods are applicable within the context of three-dimensional integrated circuits.

主权项

1. A method for measuring a contact resistance comprising:
providing a first contact resistance test structure comprising:
a substrate;at least two parallel conductor lines having a first separation distance S1 located co-planar over the substrate; andat least one perpendicular conductor line having a first linewidth W1 located perpendicular to, non-planar with and contacting the two parallel conductor lines absent a via interposed between the perpendicular conductor line and either of the two parallel conductor lines; and measuring a first resistance R1 through the first contact resistance test structure by contact to the two parallel conductor lines.