发明名称 Substrate-related-operation performing apparatus and substrate-related-operation performing system
摘要 A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.
申请公布号 US9055708(B2) 申请公布日期 2015.06.09
申请号 US201314043088 申请日期 2013.10.01
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 Kodama Seigo;Suhara Shinsuke
分类号 B23P19/00;H05K13/04 主分类号 B23P19/00
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A substrate-related-operation performing apparatus configured to perform a substrate-related operation to a circuit substrate, the apparatus comprising: an operation performing head configured to perform the substrate-related operation to the circuit substrate; a head supporting member to which the operation performing head is attached; a head moving device configured to move the head supporting member and move the operation performing head attached thereto, on a plane parallel to the circuit substrate; and an image taking device supported by the head supporting member such that when the head supporting member is moved by the head moving device, the image taking device is moved with the operation performing head so as to take an image of a fiducial mark affixed to a surface of the circuit substrate, wherein: an arbitrary sort of operation performing head selected from: (a) an applying head configured to perform an adhesive applying operation, (b) a mounting head configured to perform a component mounting operation, or (c) an inspecting head configured to perform an inspecting operation about results of a performed substrate-related operation, is attached as the operation performing head to the head supporting member, and each sort of operation performing head, of either: (a) the applying head, (b) the mounting head, or (c) the inspecting head, when attached, is capable of being: (i) removed from the head supporting member, (ii) exchanged with either of the other two sorts of operation performing heads, and (iii) replaced by either of the other two sorts of operation performing heads on the head supporting member.
地址 Chiryu JP
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