Packaged optical semiconductor device

摘要

A wiring is located on a multilayer ceramic substrate. A ceramic block is located on the multilayer ceramic substrate. Electronic parts, including a semiconductor laser, are located on a surface of the ceramic block. A wiring located on the surface of the ceramic block connects some of the electronic parts to the wiring. A metallic cap with a glass window is located on the multilayer ceramic substrate. This metallic cap covers the ceramic block and the electronic parts, including the semiconductor laser.

主权项

1. A packaged optical semiconductor device comprising:
a multilayer ceramic substrate having opposed first and second surfaces and a thickness between the first and second surfaces, and including a first via penetrating through the thickness of the multilayer ceramic substrate and exposed at the first surface of the multilayer ceramic substrate; a first wiring located on the first surface of the multilayer ceramic substrate and in electrical contact with the first via; a block having opposed first and second end surfaces, and side surfaces extending between the first and second end surfaces of the block, wherein the block is mounted, relative to the multilayer ceramic substrate, with the second end surface of the block facing the first surface of the ceramic multilayer substrate; a plurality of electronic parts mounted on at least one of the first end surface and the side surfaces of the block, wherein the plurality of electronic parts includes an optical semiconductor element; a second wiring located on at least one of the side surfaces, of the block and connecting at least one of the electronic parts, of the plurality of electronic parts, to the first wiring; and a metallic cap with a window, mounted on the first surface of the multilayer ceramic substrate, and completely enclosing the block, the first and second wirings, and the plurality of electronic parts within a volume defined by and between the metallic cap and the first surface of the multilayer ceramic substrate, wherein the first wiring is joined to and electrically connected to the second wiring within the volume, thereby mounting the block relative to the multilayer ceramic substrate.