Finfet and method of fabricating the same

摘要

A method of fabricating a fin field effect transistor (FinFET) comprises providing a substrate comprising a major surface, forming a first and second fin extending upward from the substrate major surface to a first height, forming an insulation layer comprising a top surface extending upward from the substrate major surface to a second height less than the first height, wherein a portion of the first and second fin extend beyond the top surface of the insulation layer. The method also includes selectively growing an epitaxial layer covering each fin, annealing the substrate to have each fin covered by a bulbous epitaxial layer defining an hourglass shaped cavity between adjacent fins, wherein the cavity comprises an upper and lower portion. The method includes forming a metal material over the bulbous epitaxial layer and annealing the substrate to convert the bulbous epitaxial layer bordering the lower portion of the cavity to silicide.

主权项

1. A method of fabricating a fin field effect transistor (FinFET) comprising:
providing a substrate comprising a major surface; forming a first fin and a second fin extending upward from the substrate major surface to a first height; forming an insulation layer comprising a top surface extending upward from the substrate major surface to a second height less than the first height, wherein a portion of the first fin and a portion of the second fin extend beyond the top surface of the insulation layer; selectively growing an epitaxial layer covering each fin; annealing the substrate to have each fin covered by a bulbous epitaxial layer defining an hourglass shaped cavity between adjacent fins, wherein the cavity comprises an upper portion and a lower portion; forming a metal material over the bulbous epitaxial layer; and annealing the substrate to convert the bulbous epitaxial layer bordering the lower portion of the cavity to silicide.