| 摘要 |
<p>The invention concerns an electronic module (21) with a dual contact and contactless communication interface, in particular for a smart card, said module comprising a substrate (8) having, on a first face, an electric contact terminal (35) allowing operation by contact with the corresponding contacts of a smart card reader, and comprising, on a second face, an antenna (3) provided with at least a coil and a microelectronic chip (2) coated with a drop of insulating resin (7) and provided with a contactless communication interface, said antenna comprising a proximal connection pad (4) and a distal connection pad (5) intended to be connected to the corresponding terminals (30, 31) of said contactless communication interface of the chip (2), characterised in that the proximal connection pad (4) and distal connection pad (5) of the antenna (3) are arranged inside the encapsulation area by an insulating resin (7), in such a way as to produce a conductive bridge between each proximal connection pad (4) or distal connection pad (5) and the corresponding terminal (32, 31) of the chip, directly via connection wires (12) between said connection pads (4, 5) and the corresponding terminals (32, 31) of the chip, without using vias.</p> |
