| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor element housing package that is excellent in mounting a light receiving element for a monitor, and an optical semiconductor device.SOLUTION: An optical semiconductor element housing package comprises: a metal substrate 1 having a mounting part 1a for a light receiving element at a central part of its upper surface; a pedestal part 2 provided so as to stand on the metal substrate 1 around the mounting part 1a; a square-shaped circuit board 3 bonded with the pedestal part 2, and on which a light-emitting element is mounted; and a lead terminal 6 inserted into the metal substrate 1, and fixed to it via a sealing material 2. The circuit board 3 is bonded to the pedestal part 2 along three sides except for the central part of one side adjacent to the upper surface of the metal substrate 1. A bonding material is less likely to be flown into the mounting part 1a. |
