发明名称 |
METHOD AND APPARATUS FOR MEASURING THICKNESS OF SAMPLE ATTACHED ON SUBSTERATE |
摘要 |
The present invention relates to a method and an apparatus for measuring a thickness of a sample attached on a substrate. The method for measuring a thickness of a sample attached on a substrate according to an embodiment of the present invention comprises: a step of detecting an intensity of an initial X-ray propagating through an empty area; a step of detecting an intensity of a first transmission X-ray transmitting through a first transmission body comprised of a substrate only and an intensity of a first scattered X-ray scattered from the first transmission body; a step of detecting an intensity of a second transmission X-ray transmitting through a second transmission body comprised of the substrate and a sample attached on the substrate and an intensity of a second scattered X-ray scattered from the sample; and a step of calculating the thickness of the sample from the initial X-ray intensity, the first and second transmission X-ray intensities, and the first and second scattered X-ray intensities. Additionally, the apparatus for measuring a thickness of a sample attached on a substrate is disclosed. |
申请公布号 |
KR20150062546(A) |
申请公布日期 |
2015.06.08 |
申请号 |
KR20130147316 |
申请日期 |
2013.11.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SON, BAE SOON;JUNG, SO YOUNG;PARK, SUNG YEOL;HAM, SUK JIN |
分类号 |
G01B15/02;G01N23/00 |
主分类号 |
G01B15/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|