发明名称 METHOD AND APPARATUS FOR MEASURING THICKNESS OF SAMPLE ATTACHED ON SUBSTERATE
摘要 The present invention relates to a method and an apparatus for measuring a thickness of a sample attached on a substrate. The method for measuring a thickness of a sample attached on a substrate according to an embodiment of the present invention comprises: a step of detecting an intensity of an initial X-ray propagating through an empty area; a step of detecting an intensity of a first transmission X-ray transmitting through a first transmission body comprised of a substrate only and an intensity of a first scattered X-ray scattered from the first transmission body; a step of detecting an intensity of a second transmission X-ray transmitting through a second transmission body comprised of the substrate and a sample attached on the substrate and an intensity of a second scattered X-ray scattered from the sample; and a step of calculating the thickness of the sample from the initial X-ray intensity, the first and second transmission X-ray intensities, and the first and second scattered X-ray intensities. Additionally, the apparatus for measuring a thickness of a sample attached on a substrate is disclosed.
申请公布号 KR20150062546(A) 申请公布日期 2015.06.08
申请号 KR20130147316 申请日期 2013.11.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SON, BAE SOON;JUNG, SO YOUNG;PARK, SUNG YEOL;HAM, SUK JIN
分类号 G01B15/02;G01N23/00 主分类号 G01B15/02
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