SPUTTERING APPARATUS HAVING ELECTROSTATIC CHUCK

摘要

The present invention provides a sputtering apparatus having an electrostatic chuck, which comprises: a support plate composed of a plate shape, wherein an accommodating hole is formed in a central area; an electrostatic unit having an electrostatic electrode and supported by being composed of a plate shape and coupled to the accommodating hole; a heating unit having a hot wire and placed on a lower portion of the electrostatic unit; and a substrate support unit having a cooling water pipe and a cooling unit placed on a lower portion of the heating unit.