发明名称 |
METHODS OF BONDING AND ARTICLES FORMED THEREBY |
摘要 |
A method of bonding a polymer film to a mating part, including:
placing a mating part in a nest;contacting the polymer film and the mating part;heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both;actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; andactuating the die away from the polymer film. |
申请公布号 |
US2015152373(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201514620756 |
申请日期 |
2015.02.12 |
申请人 |
CORNING INCORPORATED |
发明人 |
Bennett Scott Matthew |
分类号 |
C12M1/12;B32B27/36;B32B27/30;H05B3/03;B32B27/08;B32B15/08;B32B15/18;B32B15/20;B32B27/28;B32B27/32 |
主分类号 |
C12M1/12 |
代理机构 |
|
代理人 |
|
主权项 |
1. An assembly comprising:
a nest; a mating part housed in the nest; a polymer film in contact with the mating part; and a die comprising a thermally conductive silicone and a backer, wherein the thermally conductive silicone is located on the backer and the thermally conductive silicone is in contact with the polymer film. |
地址 |
CORNING NY US |