| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermosetting die bond film which allows thermally conductive particles to be filled at a high filling rate, and enables the satisfactory unevenness followability and the satisfactory achievement of moisture resistance and reflow resistance; a die bond film with dicing sheet arranged by use of such a thermosetting die bond film; and a method for manufacturing a semiconductor device. ! SOLUTION: A thermosetting die bond film comprises thermally conductive particles. In a particle size distribution of the thermally conductive particles, a peak A is present in a range of particle sizes smaller than 2 μm, a peak B is present in a range of particle sizes of 2 μm or larger; and the ratio of the particle size of the peak B to the particle size of the peak A is 5-20. The thermosetting die bond film has a post-heat curing thermal conductivity of 1 W/m K or more. ! COPYRIGHT: (C)2015,JPO&INPIT |
