| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing solder forming a solder layer from flowing out to the other member side.SOLUTION: A semiconductor device includes: a substrate; a semiconductor element which is fixed to one side of the substrate through a first solder layer; a terminal which is fixed to the one side of the substrate through a second solder layer; and a solder outflow prevention part which is provided at the terminal side of the semiconductor element on the one side of the substrate. A distance between the solder outflow prevention part and the semiconductor element is longer than a thickness of the first solder layer. |
