| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic gold plating solution that can afford higher deposition efficiency than the conventional gold plating solution without causing poor appearance of a gold plated film while favorably retaining mechanical characteristics, wear resistance, electrical characteristics and the like and can reduce the production cost by shortening the time required for gold plating deposition and reducing the concentration of expensive gold contained in the gold plating solution. ! SOLUTION: The electrolytic gold plating solution contains: a gold cyanide salt as a gold source; and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one kind or two or more kinds of specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amino group, an alkylamino group, |
