| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which dissipates the heat generated in an internal element of an imaging device without creating a heat spot in an exterior cover. ! SOLUTION: A heat dissipation sheet 204 is arranged on a heater element 205 mounted on a MAIN substrate 201. A component fastening a structure sheet metal 202 and a heatsink 203 is arranged on the heat dissipation sheet. A TOP cover 108 is arranged on the structure sheet metal. Heat is equally dissipated to an exterior appearance cover 108 by providing an air layer between the heatsink 203 to which the heat of the internal element was dissipated and the exterior appearance cover and equally dissipating heat to the TOP cover. ! COPYRIGHT: (C)2015,JPO&INPIT |
