发明名称 MATCHING METHOD AND MICROWAVE HEATING PROCESSING METHOD
摘要 <p>Provided are, in an apparatus for heating microwave, a matching method and a method for heating microwave capable of suppressing a reflected wave and heating a substrate in high efficiency of the microwave. The method for heating microwave includes: a step (S1) for adjusting a wafer (W) to a first height position; a step (S2) for matching impedances between a magnetron (31) and a treatment container (2) when the wafer (W) is maintained at a first height position; a step (S3) for determining a second height position based on the temperature of the wafer (W); a step (S4) for performing matching of impedance again when the wafer (W) is maintained at the second height position; a step (S5) for performing a heating process by radiating the wafer (W) maintained at the second height position with microwave introduced into the treatment container (2) by the microwave introducing device (3).</p>
申请公布号 KR20150060567(A) 申请公布日期 2015.06.03
申请号 KR20140164252 申请日期 2014.11.24
申请人 TOKYO ELECTRON LIMITED 发明人 HONG, SEOK HYOUNG;ASHIDA MITSUTOSHI;MIYAGAWA YOSHIHIRO;KOIZUMI MASAKI
分类号 H01L21/268;H01L21/324 主分类号 H01L21/268
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