| 摘要 |
<p>The invention relates to an appliance (1) including a treating chamber (3) in which a process medium is introduced; a heat pump (6) having a refrigerant circuit (68) in which a refrigerant can flow, the refrigerant circuit including a first heat exchanger (61) where the refrigerant is cooled off and said process medium is warmed up, a second heat exchanger (62) where the refrigerant is heated up, a compressor (63) to pressurize and circulate the refrigerant through the refrigerant circuit, the compressor including a lubricant, and a pressure-lowering device (64). The first and second heat exchanger, compressor and pressure-lowering device are operatively connected through refrigerant circuit piping (65) into which the refrigerant is apt to flow. The refrigerant circuit piping (65) comprises at least a narrow piping portion having a narrow hydraulic diameter (D Hnarrow ), and the ratio between the narrow hydraulic diameter (D Hnarrow ) and the hydraulic diameter (D H ) of the remaining piping portions of the refrigerant circuit piping (65) is comprised between 0.4 and 0.95. The at least one narrow piping portion being located in at least one of:
- between an outlet of the second heat exchanger (62) and an inlet of the compressor (63a), or
- Between an outlet of the first heat exchanger (61) and an inlet of the pressure-lowering device (64), or
- Between an outlet of the pressure-lowering device (64) and an inlet of the second heat exchanger (62), or
- below or at the suction inlet level (L) of the compressor (63).</p> |
