发明名称 Modular apparatus and method for attaching multiple devices
摘要 A modular apparatus for attaching sensors and electronics is disclosed. The modular apparatus includes a square recess including a plurality of cavities and a reference cavity such that a pressure sensor can be connected to the modular apparatus. The modular apparatus also includes at least one voltage input hole and at least one voltage output hole operably connected to each of the plurality of cavities such that voltage can be applied to the pressure sensor and received from the pressure sensor.
申请公布号 US9046426(B1) 申请公布日期 2015.06.02
申请号 US201213524327 申请日期 2012.06.15
申请人 The United States of America as Represented by the Administrator of National Aeronautics and Space Administration 发明人 Okojie Robert S
分类号 G01L7/00 主分类号 G01L7/00
代理机构 代理人 Earp, III Robert H.
主权项 1. An apparatus, comprising: a substrate member comprising a ceramic material, said substrate member having an elongated section having at least one square recess, a plurality of cavities, a pressure reference cavity, and a section having at least one voltage input hole and at least one voltage output hole; wherein each of the holes contains a means to provide an electric connection therethrough; wherein the at least one voltage input hole is operably connected to one of the plurality of cavities of the elongated section, and the at least one voltage output hole is operably connected to another one of the plurality of cavities of the elongated section; and wherein one end of each one of the plurality of cavities is connected to the square recess, and the other end of each one of the plurality of cavities is connected to one of the two voltage holes.
地址 Washington DC US