| 摘要 |
A method of fabricating an epi-wafer includes providing a wafer in a susceptor, and growing an epi-layer on the wafer. The growing of the epi-layer on the wafer includes a first process of supplying a first input quantity of a raw material to the susceptor, and a second process of supplying a second input quantity of the raw material to the susceptor. The first input quantity is smaller than the second input quantity. An epi-wafer includes a wafer and an epi-layer formed on the wafer. Surface defects of the wafer are 1 ea/cm2 or less. |
