LEAD-FREE SOLDER ALLOY AND SEMICONDUCTOR DEVICE

摘要

A semiconductor device (20) which comprises: a semiconductor chip (1); a member to be connected (5) which is connected to the semiconductor chip (1) with a solder alloy (lead-free solder alloy) (2) being interposed therebetween; and an external terminal which is electrically connected to the semiconductor chip (1). The solder alloy (2) in the semiconductor device (20) is composed of 5-10% by weight of Cu, from 1% by weight to 4% by weight (inclusive) of Bi, and 1% by weight or more but less than 10% by weight of Sb and/or from 1% by weight to 4% by weight (inclusive) of In, with the balance made up of Sn.